Micron isn’t the only big chip maker adjusting its announced schedules to launch new semiconductor plants. Other big chip makers, including Intel, also have delayed their plans. The companies are citing labor and supply shortages and the slow rollout of federal money.

美光并不是唯一一家调整其宣布的新建半导体工厂时间表的大型芯片制造商。包括英特尔在内的其他大型芯片制造商也推迟了他们的计划。这些公司的理由是劳动力和供应短缺以及联邦资金发放缓慢。

Intel had originally announced it would open its first fabrication plant, or fab, in central Ohio next year; now the company says it will be 2027 or 2028. Taiwan Manufacturing Semiconductor Co., the world’s largest chip maker, has announced several construction delays of its proposed plant in Arizona. Even several TMSC suppliers now say their plans are on hold.

英特尔最初宣布将于明年在俄亥俄州中部开设第一家制造工厂。现在该公司表示将在 2027 年或 2028 年进行。全球最大的芯片制造商台积电已宣布其位于亚利桑那州的拟建工厂的建设数次推迟。甚至一些 TMSC 供应商现在也表示他们的计划已被搁置。

The delays could be a sign that semiconductor companies were overly optimistic in their original plans or that the Biden administration’s hopes of jump-starting chip production in the U.S. is harder than expected.

这些延误可能表明半导体公司对其最初的计划过于乐观，或者拜登政府希望在美国启动芯片生产的希望比预期的要困难。

Or some of both.

或者两者兼而有之。

One sticking point had been the longer-than-expected announcements of grants from the 2022 CHIPS and Science Act, which offered $52 billion in incentives to lure chipmakers back to the United States as a national security priority. Most of the world’s chips are made overseas, largely in Taiwan, which sits just 100 miles from China.

一个症结在于，2022 年《芯片和科学法案》宣布拨款的时间比预期要长，该法案提供 520 亿美元的激励措施，以吸引芯片制造商回到美国，作为国家安全的优先事项。世界上大部分芯片都是在海外生产的，其中大部分是在距离中国大陆仅 100 英里的台湾生产的。

One industry analyst said chip companies expected to know the scope of their awards months ago.

一位行业分析师表示，芯片公司预计在几个月前就知道其奖项的范围。

The big grants have finally started to roll out. GlobalFoundries was awarded $1.5 billion in CHIPS grants and $1.6 billion in loans to expand its fabs in Saratoga County and Vermont. On Wednesday, Intel received $8.5 billion in grants and $11 billion in loans. U.S. Department of Commerce officials said that will be the largest award package.

大笔赠款终于开始发放。 GlobalFoundries 获得了 15 亿美元的 CHIPS 拨款和 16 亿美元的贷款，用于扩建其在萨拉托加县和佛蒙特州的晶圆厂。周三，英特尔获得了 85 亿美元的赠款和 110 亿美元的贷款。美国商务部官员表示，这将是最大的一揽子奖励计划。

Micron officials won’t say when they expect to hear about the awards and how much the company might get.

美光公司的官员没有透露他们预计何时会听到这些奖项以及该公司可能获得多少奖金。

“We are working through the process,” was all Carson Henry, Micron’s senior director of strategic U.S. expansion, would say at a news conference Tuesday night in Clay.

“我们正在努力完成这个过程，”美光科技美国战略扩张高级总监卡森·亨利 (Carson Henry) 在周二晚上在克莱举行的新闻发布会上说道。

Carson said Micron had set “a very, very aggressive target” last year when it laid out a construction timeline.

卡森表示，美光去年在制定建设时间表时设定了“一个非常非常激进的目标”。

“We’re moving as quickly as we can,” Henry said. “Our schedule right now is early 2025. When we look at a 20-year project, that sort of timing difference is relatively small.”

“我们正在尽快采取行动，”亨利说。 “我们现在的计划是 2025 年初。当我们考虑一个 20 年的项目时，这种时间差异相对较小。”

The new construction schedule is even more aggressive. Initially, Micron said it would start building in 2024 and open the first two fabs by 2032, an eight-year construction timetable. Construction time has now been shrunk to four years, from 2025 groundbreaking to 2029 production start.

新的施工进度更加激进。美光最初表示将于 2024 年开始建设，并在 2032 年之前开设前两座晶圆厂，建设时间表为八年。建设时间现已缩短为四年，从2025年破土动工到2029年投产。

Intel started working on its $20 billion fab complex near Columbus, Ohio, in 2022, intending to open by 2025. In a report filed this week with the Ohio development office, however, the company now says it will be 2027 or 2028 before the first chips are produced. Intel’s plans rival Micron’s, with a planned investment of up to $100 billon.

英特尔于 2022 年开始在俄亥俄州哥伦布市附近建造耗资 200 亿美元的晶圆厂综合体，计划于 2025 年开业。然而，在本周向俄亥俄州开发办公室提交的一份报告中，该公司现在表示，第一批晶圆厂将在 2027 年或 2028 年建成。芯片被生产出来。英特尔的计划与美光的竞争，计划投资高达 1000 亿美元。

TSMC has delayed its plant in Arizona several times, citing labor shortages and negotiations with federal officials for CHIPS grants.

台积电已多次推迟在亚利桑那州的工厂建设，理由是劳动力短缺以及与联邦官员就 CHIPS 拨款进行谈判。