晶片革命：小晶片推動半導體技術創新

全球小晶片市場預計將大幅成長，預計到 2033 年將達到約 1,070 億美元，複合年增長率為 42.5%。在對高效微處理器的需求不斷增長的推動下，這種激增歸因於它們在各種高科技行業中提高性能和降低成本的能力。影響成長的關鍵因素包括半導體技術和封裝技術的進步。然而，整合多個小晶片和確保相容性的複雜性帶來了挑戰。儘管存在這些障礙，但隨著小晶片繼續徹底改變電子設備，為運算、電信和消費性電子領域的新可能性鋪平道路，市場仍然充滿希望。

The Chiplets Market: A Transformation in Semiconductor Technology Fueling Innovation

Chiplet 市場：半導體技術變革推動創新

Introduction

介紹

The global chip market is poised for an explosive surge in the coming decade. In 2023, it stands at approximately USD 3.1 billion, projected to soar to a staggering USD 107.0 billion by 2033, representing a remarkable 42.5% compound annual growth rate (CAGR) from 2024 to 2033. Chiplets, small chips that can be seamlessly integrated to create more complex and efficient microprocessors, are driving this growth, finding widespread adoption across high-tech industries. Their ascendancy is attributed to their unparalleled ability to enhance performance and reduce costs in electronic devices, contributing to the substantial growth anticipated for the chiplets market.

全球晶片市場預計在未來十年將爆炸性成長。 2023 年，這一數字約為 31 億美元，預計到 2033 年將飆升至驚人的 1070 億美元，2024 年至 2033 年複合年增長率 (CAGR) 高達 42.5%。器正在推動這一增長，並在高科技行業中廣泛採用。它們的優勢歸功於其在提高電子設備性能和降低成本方面無與倫比的能力，從而促進小晶片市場預期的大幅成長。

Drivers of Market Growth

市場成長的驅動因素

Several key factors are fueling the growth of the global chiplets market. First and foremost, the insatiable demand for powerful yet energy-efficient microprocessors in sectors such as computing, telecommunications, and consumer electronics serves as a major catalyst. Chiplets offer greater flexibility and scalability, allowing manufacturers to meet specific performance requirements while optimizing space and power consumption. Furthermore, advancements in semiconductor technology, including the development of sophisticated packaging techniques, have made chiplet integration more feasible and cost-effective.

有幾個關鍵因素正在推動全球小晶片市場的成長。首先也是最重要的，運算、電信和消費性電子等領域對功能強大且節能的微處理器的永不滿足的需求是主要的催化劑。小晶片提供了更大的靈活性和可擴展性，使製造商能夠滿足特定的性能要求，同時優化空間和功耗。此外，半導體技術的進步，包括複雜封裝技術的發展，使得小晶片整合變得更加可行且更具成本效益。

Challenges to Market Growth

市場成長面臨的挑戰

Despite the promising growth prospects, the market presents several challenges. The complexity of designing and integrating multiple chiplets into a single system poses significant technical hurdles. Ensuring compatibility and efficient communication between different chiplets within a processor can be a formidable task, requiring advanced design and testing processes. Additionally, supply chain issues related to the precision manufacturing and testing of chiplets can impact production timelines and costs.

儘管成長前景廣闊，但市場仍面臨一些挑戰。將多個小晶片設計和整合到單一系統中的複雜性帶來了重大的技術障礙。確保處理器內不同小晶片之間的兼容性和高效能通訊可能是一項艱鉅的任務，需要先進的設計和測試流程。此外，與小晶片精密製造和測試相關的供應鏈問題可能會影響生產時間表和成本。

Market Dynamics

市場動態

The chiplets market is currently dominated by CPU chiplets, which accounted for over 41% of the market share in 2023. Their prominence stems from their efficiency and ability to enhance processing power while maintaining energy conservation. The consumer electronics segment led the market in 2023, holding more than 26% of the share. This segment's growth is fueled by the rapid technological advancements in devices such as smartphones, laptops, and wearables, where chiplets are valued for their flexibility and scalability. The IT and telecommunication services segment also shows significant presence, capturing over 24% market share in 2023, driven by the increasing demand for high-performance computing solutions in data centers and the need for efficient network infrastructure.

目前小晶片市場以CPU小晶片為主，到2023年，CPU小晶片將佔據超過41%的市場份額。 2023年，消費性電子領域將引領市場，佔超過26%的份額。該細分市場的成長得益於智慧型手機、筆記型電腦和穿戴式裝置等設備的快速技術進步，其中小晶片因其靈活性和可擴展性而受到重視。由於資料中心高效能運算解決方案的需求不斷增長以及對高效網路基礎設施的需求，IT 和電信服務領域也展現了重要的影響力，到 2023 年將佔據超過 24% 的市場份額。

Geographically, the Asia-Pacific (APAC) region emerged as the leading player in the chiplets market, capturing over 31% of the global share in 2023. APAC's dominant position can be attributed to its advanced semiconductor manufacturing capabilities and rapid pace of technological advancements.

從地理上看，亞太地區(APAC) 成為小晶片市場的領導者，到2023 年將佔據全球31% 以上的份額。 。

Chiplets Statistics

小晶片統計

In 2023, global investment in chiplet technology and research and development reached a staggering ~USD 3.2 billion, a significant increase of 35% from the previous year. The adoption rate of chiplet-based designs among semiconductor companies surged to 82%, up from 68% in 2022, reflecting the growing recognition of chiplet technology's advantages in the industry. Chiplet-based processors have demonstrated a 25% improvement in performance, primarily due to their capacity to integrate specialized processing elements tailored for specific tasks, such as AI processing.

2023年，全球chiplet技術和研發投入達到驚人的約32億美元，較上年大幅成長35%。半導體公司基於chiplet的設計採用率從2022年的68%飆升至82%，反映出業界對chiplet技術優勢的日益認可。基於 Chiplet 的處理器的性能提高了 25%，這主要是因為它們能夠整合針對特定任務（例如 AI 處理）定制的專用處理元素。

A remarkable 72% of high-performance computing (HPC) and artificial intelligence (AI) hardware vendors adopted chiplet-based architectures for their latest products in 2023. A significant investment of ~$950 million was directed toward enhancing testing and validation methodologies for chiplet-based systems in 2023, aiming to improve reliability and yields.

2023 年，72% 的高效能運算 (HPC) 和人工智慧 (AI) 硬體供應商在其最新產品中採用了基於 Chiplet 的架構。 2023 年基於系統，旨在提高可靠性和產量。

Chiplet-based mobile processors recorded a remarkable 20% enhancement in power efficiency in 2023, leading to extended battery life in devices such as smartphones and tablets. A substantial 78% of semiconductor foundries and outsourced semiconductor assembly and test (OSAT) providers expanded their services to include advanced chiplet integration in 2023, up from 65% in 2022.

到 2023 年，基於 Chiplet 的行動處理器的能源效率顯著提高了 20%，從而延長了智慧型手機和平板電腦等裝置的電池壽命。到 2023 年，78% 的半導體代工廠和外包半導體組裝與測試 (OSAT) 供應商將其服務擴展至包括先進的小晶片集成，這一比例高於 2022 年的 65%。

In 2023, an investment of ~$820 million was allocated to developing chiplet-based heterogeneous integration platforms. These platforms represent a transformative approach to semiconductor design and assembly, impacting a wide range of industries.

2023 年，將投資約 8.2 億美元用於開發基於小晶片的異質整合平台。這些平台代表了半導體設計和組裝的變革性方法，影響了廣泛的產業。

Emerging Trends

新興趨勢

Advancements in Packaging Technologies: Innovations in packaging technologies such as 2.5D/3D packaging and Wafer-Level Chip Scale Packaging (WLCSP) are gaining prominence. These advancements are vital for enhancing the performance and functionality of chiplets in complex electronic systems.

封裝技術的進步：2.5D/3D 封裝和晶圓級晶片級封裝 (WLCSP) 等封裝技術的創新日益引人注目。這些進步對於增強複雜電子系統中小晶片的性能和功能至關重要。

Expansion in High-Performance Computing (HPC): The growing demand for high-performance computing in sectors like data centers and AI applications is driving the development of chiplets. CPU and GPU chiplets are increasingly adopted for their ability to efficiently deliver enhanced processing power.

高效能運算 (HPC) 的擴展：資料中心和人工智慧應用等領域對高效能運算的需求不斷增長，正在推動小晶片的發展。 CPU 和 GPU 小晶片因其能夠有效地提供增強的處理能力而被越來越多地採用。

Geographic Expansion: The Asia Pacific region is emerging as a significant market, with countries like China and India leading due to their advanced semiconductor manufacturing capabilities and substantial growth in consumer electronics.

地理擴張：亞太地區正在成為一個重要的市場，其中中國和印度等國家因其先進的半導體製造能力和消費性電子產品的大幅成長而處於領先地位。

Innovations by Startups: New market entrants are constantly introducing innovative solutions, particularly in chiplet interconnect and optical I/O technologies. These developments are crucial for the market's future growth and diversification.

新創公司的創新：新的市場進入者不斷推出創新的解決方案，特別是在小晶片互連和光學 I/O 技術方面。這些發展對於市場未來的成長和多元化至關重要。

Top Use Cases

主要用例

Consumer Electronics: Chiplets are extensively used in devices such as smartphones, laptops, and wearables. Their modular design provides the necessary flexibility and scalability required for the development of sophisticated and compact devices, meeting the demands of rapidly advancing technology.

消費性電子產品：小晶片廣泛用於智慧型手機、筆記型電腦和穿戴式裝置等裝置。它們的模組化設計提供了開發複雜和緊湊設備所需的靈活性和可擴展性，滿足快速發展的技術的需求。

Data Centers and Cloud Computing: In data centers and cloud computing, CPU chiplets play a critical role. Their modular and efficient performance characteristics enable scalable and customizable solutions, essential for managing extensive data processing in modern cloud services.

資料中心和雲端運算：在資料中心和雲端運算中，CPU 小晶片發揮著至關重要的作用。其模組化和高效的效能特徵可實現可擴展和可自訂的解決方案，這對於管理現代雲端服務中的廣泛資料處理至關重要。

Automotive Electronics: Chiplets are increasingly utilized in the automotive industry, particularly as vehicles become more electrified and rely heavily on advanced computational power for navigation, safety, and entertainment systems.

汽車電子：小晶片在汽車產業的應用越來越廣泛，特別是隨著車輛變得更加電氣化並且嚴重依賴導航、安全和娛樂系統的先進運算能力。

Healthcare: In the healthcare sector, chiplets are employed in devices that perform high-computational tasks, such as imaging and diagnostics equipment. Their efficiency and processing capabilities make them well-suited for these applications.

醫療保健：在醫療保健領域，小晶片用於執行高運算任務的設備，例如影像和診斷設備。它們的效率和處理能力使其非常適合這些應用。

Artificial Intelligence and Machine Learning: GPU chiplets are critical in AI and ML applications for their ability to efficiently handle complex graphics and computational tasks. This is particularly important in sectors like gaming and research, where rigorous data processing is essential.

人工智慧和機器學習：GPU 小晶片在 AI 和 ML 應用中至關重要，因為它們能夠有效處理複雜的圖形和運算任務。這在遊戲和研究等領域尤其重要，因為嚴格的數據處理至關重要。

Market News

市場新聞

Intel's Launch of Ponte Vecchio GPUs: Intel introduced its Ponte Vecchio GPUs, which utilize a chiplet-based design. This innovation is noteworthy for incorporating HBM3 memory architecture, designed to enhance performance in high-performance computing (HPC) applications. The deployment of HBM3 suggests a strategic focus on fulfilling the escalating computational demands of sectors such as artificial intelligence, scientific research, and complex simulations.

英特爾推出 Ponte Vecchio GPU：英特爾推出了 Ponte Vecchio GPU，該 GPU 採用基於小晶片的設計。這項創新值得注意的是，它融入了 HBM3 記憶體架構，旨在增強高效能運算 (HPC) 應用程式的效能。 HBM3 的部署顯示戰略重點是滿足人工智慧、科學研究和複雜模擬等領域不斷增長的運算需求。

NVIDIA's Introduction of Grace CPU: In a strategic move to expand into the server market, NVIDIA launched the Grace CPU, also based on a chiplet design. This product promises exceptional performance and scalability for data centers, signaling NVIDIA's ambition to capture new segments within the industry. The Grace CPU's arrival may reshape competitive dynamics, particularly in the server segment, where efficiency and processing power are highly valued.

NVIDIA 推出 Grace CPU：作為進入伺服器市場的策略舉措，NVIDIA 推出了同樣以小型晶片設計為基礎的 Grace CPU。該產品承諾為資料中心提供卓越的效能和可擴展性，標誌著 NVIDIA 佔領產業新細分市場的雄心。 Grace CPU 的到來可能會重塑競爭動態，特別是在高度重視效率和處理能力的伺服器領域。

Samsung's Showcase of 3D GAA Technology: Samsung unveiled its advancement in transistor technology with the 3D Gate-All-Around (GAA) method. This technology enables 3D stacking of chiplets, which could significantly increase density and enhance performance. The introduction of 3D GAA technology positions Samsung as a key innovator in the semiconductor space, potentially influencing future design paradigms across the industry.

三星展示 3D GAA 技術：三星透過 3D Gate-All-Around (GAA) 方法展示了其在電晶體技術方面的進步。此技術可實現小晶片的 3D 堆疊，從而顯著提高密度並增強性能。 3D GAA 技術的推出使三星成為半導體領域的關鍵創新者，有可能影響整個產業的未來設計範式。

Conclusion

結論

The chiplets market presents a landscape of promising opportunities, spurred by their adaptation to diverse applications and innovations in semiconductor technology. However, the sector faces notable challenges, including complexity in design and integration, standardization issues, and advanced thermal management requirements. As the technology matures and solutions to these challenges emerge, the adoption of chiplets is expected to expand, creating significant opportunities in various high-tech sectors. This evolution will likely be supported by continuous advancements in packaging technologies and a growing focus on applications such as AI and quantum computing. The overall outlook for the chiplets market is one of cautious optimism, where the potential benefits far outweigh the current hurdles.

小晶片市場呈現出充滿希望的機遇，受到其對半導體技術多樣化應用和創新的推動。然而，該行業面臨著顯著的挑戰，包括設計和整合的複雜性、標準化問題和先進的熱管理要求。隨著技術的成熟和針對這些挑戰的解決方案的出現，小晶片的採用預計會擴大，從而在各個高科技領域創造重大機會。這種演變可能會得到封裝技術的不斷進步以及對人工智慧和量子計算等應用的日益關注的支持。小晶片市場的整體前景是謹慎樂觀的，潛在的好處遠遠超過當前的障礙。