三星电子公司已正式获得批准,以向NVIDIA Corp.(NASDAQ:NVDA)提供高带宽记忆(HBM)芯片,这标志着AI半导体竞赛的重大突破。
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Samsung’s HBM3E chips have been approved by Nvidia for integration into its less powerful AI processors, specifically those intended for the Chinese market. This move by Nvidia is a strategic response to the U.S. export restrictions, which aim to limit the capabilities of advanced AI hardware being sold to China.
三星的HBM3E芯片已被NVIDIA批准,将其集成到其功能较低的AI处理器中,特别是针对中国市场的加工者。 NVIDIA的这一举动是对美国出口限制的战略反应,旨在限制出售给中国的先进AI硬件的能力。
By utilizing Samsung’s HBM3E chips, Nvidia can continue to cater to the Chinese market while adhering to the geopolitical constraints imposed by the U.S. government.
通过利用三星的HBM3E芯片,NVIDIA可以继续迎合中国市场,同时遵守美国政府施加的地缘政治约束。
This approval marks a significant win for Samsung, which has been aggressively expanding its memory production capabilities in recent years. The company aims to increase its market share and challenge SK Hynix, which has been Nvidia’s primary supplier of HBM chips.
这一批准标志着三星的重大胜利,近年来一直在积极扩大其内存生产能力。该公司旨在增加其市场份额,并挑战SK Hynix,该公司一直是NVIDIA的主要筹码供应商。
Samsung’s success with Nvidia’s HBM3E validation could pave the way for more advanced memory solutions, enhancing its competitive edge in the AI-driven semiconductor landscape.
三星在NVIDIA的HBM3E验证方面的成功可能为更高级的内存解决方案铺平道路,从而增强了其在AI驱动的半导体景观中的竞争优势。
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