三星的HBM3E Chips Power Nvidia的AI擴展，標誌著AI半導體競賽的一個主要里程碑

三星電子公司已正式獲得批准，以向NVIDIA Corp.（NASDAQ：NVDA）提供高帶寬記憶（HBM）芯片，這標誌著AI半導體競賽的重大突破。

Samsung’s HBM3E chips have been approved by Nvidia for integration into its less powerful AI processors, specifically those intended for the Chinese market. This move by Nvidia is a strategic response to the U.S. export restrictions, which aim to limit the capabilities of advanced AI hardware being sold to China.

三星的HBM3E芯片已被NVIDIA批准，將其集成到其功能較低的AI處理器中，特別是針對中國市場的加工者。 NVIDIA的這一舉動是對美國出口限制的戰略反應，旨在限制出售給中國的先進AI硬件的能力。

By utilizing Samsung’s HBM3E chips, Nvidia can continue to cater to the Chinese market while adhering to the geopolitical constraints imposed by the U.S. government.

通過利用三星的HBM3E芯片，NVIDIA可以繼續迎合中國市場，同時遵守美國政府施加的地緣政治約束。

This approval marks a significant win for Samsung, which has been aggressively expanding its memory production capabilities in recent years. The company aims to increase its market share and challenge SK Hynix, which has been Nvidia’s primary supplier of HBM chips.

這一批准標誌著三星的重大勝利，近年來一直在積極擴大其內存生產能力。該公司旨在增加其市場份額，並挑戰SK Hynix，該公司一直是NVIDIA的主要籌碼供應商。

Samsung’s success with Nvidia’s HBM3E validation could pave the way for more advanced memory solutions, enhancing its competitive edge in the AI-driven semiconductor landscape.

三星在NVIDIA的HBM3E驗證方面的成功可能為更高級的內存解決方案鋪平道路，從而增強了其在AI驅動的半導體景觀中的競爭優勢。